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US 9,854,685 B2Granted
Electronic component, method for manufacturing the electronic component, and circuit board
AssigneeMurata Manufacturing Co., Ltd.
InventorsNobuo Ikemoto, Makoto Osamura, Satoshi Sasaki, Yuki Wakabayashi
Life of this patent
Estimating the term…
Abstract
A camera module includes an image sensor IC including terminal electrodes, and a circuit board on which the image sensor IC is mounted. The circuit board includes mount electrodes to which the terminal electrodes are ultrasonically welded, a flat film member provided with the mount electrodes, and a base member to which the flat film member is bonded. An elastic modulus of the flat film member is higher than that of the base member.
Claims13
An electronic component comprising:
- a surface mount element including a terminal electrode;
- and
- a circuit board on which the surface mount element is mounted;
- wherein
- the circuit board includes:
- a flat film member including a mount electrode ultrasonically welded to the terminal electrode;
- a base member to which the flat film member is bonded;
- a via hole conductor provided in one of the base member and the flat film member;
- and
- a pad conductor provided at the other of the base member and the flat film member;
- an elastic modulus of the flat film member is higher than an elastic modulus of the base member;
- the via hole conductor is directly bonded to the pad conductor, and the mount electrode is electrically connected to the base member through the via hole conductor and the pad conductor;
- the flat film member includes an insulating member in contact with the mount electrode;
- and
- the flat film member has a dielectric constant different from that of the base member, and is provided with a functional conductor defining a high-frequency component.
12 more elements
An electronic component comprising:
- a surface mount element including a terminal electrode;
- and
- a circuit board on which the surface mount element is mounted;
- wherein
- the circuit board includes:
- a flat film member including a mount electrode ultrasonically welded to the terminal electrode;
- a base member to which the flat film member is bonded;
- a via hole conductor provided in one of the base member and the flat film member;
- and
- a pad conductor provided at the other of the base member and the flat film member;
- an elastic modulus of the flat film member is higher than an elastic modulus of the base member;
- the via hole conductor is directly bonded to the pad conductor, and the mount electrode is electrically connected to the base member through the via hole conductor and the pad conductor;
- the flat film member includes an insulating member in contact with the mount electrode;
- and
- the flat film member has magnetic permeability different from that of the base member, and is provided with a functional conductor defining a magnetic component.
12 more elements
An electronic component comprising:
- a surface mount element including a terminal electrode;
- and
- a circuit board on which the surface mount element is mounted;
- wherein
- the circuit board includes:
- a flat film member including a mount electrode ultrasonically welded to the terminal electrode;
- and
- a base member to which the flat film member is bonded;
- an elastic modulus of the flat film member is higher than an elastic modulus of the base member;
- the base member includes a recessed portion and a raised portion in one principal surface thereof;
- and
- an end portion of the flat film member is embedded in the raised portion.
9 more elements
A circuit board comprising:
- a flat film member including a mount electrode;
- a base member to which the flat film member is bonded;
- a via hole conductor provided in one of the base member and the flat film member;
- and
- a pad conductor provided at the other of the base member and the flat film member;
- wherein
- an elastic modulus of the flat film member is higher than an elastic modulus of the base member;
- the via hole conductor is directly bonded to the pad conductor, and the mount electrode is electrically connected to the base member through the via hole conductor and the pad conductor;
- the flat film member includes an insulating member in contact with the mount electrode;
- the base member includes a recessed portion and a raised portion in one principal surface thereof;
- and
- an end portion of the flat film member is embedded in the raised portion, and the mount electrode is exposed from a portion of the flat film member provided at the recessed portion.
9 more elements
A circuit board comprising:
- a flat film member including a mount electrode;
- a base member to which the flat film member is bonded;
- a via hole conductor provided in one of the base member and the flat film member;
- and
- a pad conductor provided at the other of the base member and the flat film member;
- wherein
- an elastic modulus of the flat film member is higher than an elastic modulus of the base member;
- the via hole conductor is directly bonded to the pad conductor, and the mount electrode is electrically connected to the base member through the via hole conductor and the pad conductor;
- the flat film member includes an insulating member in contact with the mount electrode;
- and
- the flat film member has a dielectric constant different from that of the base member, and is provided with a functional conductor defining a high-frequency component.
8 more elements
A circuit board comprising:
- a flat film member including a mount electrode;
- a base member to which the flat film member is bonded;
- a via hole conductor provided in one of the base member and the flat film member;
- and
- a pad conductor provided at the other of the base member and the flat film member;
- wherein
- an elastic modulus of the flat film member is higher than an elastic modulus of the base member;
- the via hole conductor is directly bonded to the pad conductor, and the mount electrode is electrically connected to the base member through the via hole conductor and the pad conductor;
- the flat film member includes an insulating member in contact with the mount electrode;
- and
- the flat film member has magnetic permeability different from that of the base member, and is provided with a functional conductor defining a magnetic component.
8 more elements
Dependencies are inferred from the claim text.