US 9,854,682 B2Granted

Component incorporating substrate and method for manufacturing component incorporating substrate

AssigneeMurata Manufacturing Co., Ltd.

InventorKuniaki Yosui

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Abstract

A laminated body of a component incorporating substrate includes insulating base members. First and second mounting terminals of a first electronic component abut on a conductor-less surface of a first insulating base member. A first interlayer connection conductor in the first insulating base member connects the first mounting terminal to a conductor pattern. Third and fourth mounting terminals of a second electronic component abut on a conductor-less surface of a second insulating base member. A second interlayer connection conductor in the second insulating base member connects the third mounting terminal to a conductor pattern that abuts a conductor pattern of the first insulating base member which faces toward the second insulating base member, and the conductor pattern of the second insulating base member faces toward the first insulating base member in a lamination direction.

Claims20

Dependent claims

A component incorporating substrate comprising:

a laminated body including a plurality of thermoplastic insulating base members each including conductors on only one surface thereof and laminated in a lamination direction, the plurality of insulating base layers including a first insulating base member including a first conductor only on one surface thereof and a second insulating base member including a second conductor only on one surface thereof;
a first electronic component and a second electronic component each disposed inside the laminated body and including a mounting terminal on one surface thereof;
and
a common conductor pattern connected to the first electronic component and the second electronic component;
wherein
the common conductor pattern is disposed between the first electronic component and the second electronic component in the lamination direction;
in the first insulating base member, a first conductor-less surface which is opposite to the main surface including the first conductor abuts the first electronic component, and an interlayer connection conductor is located at a position overlapping with the first conductor to connect the mounting terminal of the first electronic component to the first conductor;
in the second insulating base member, a second conductor-less surface which is opposite to the main surface including the second conductor abuts the second electronic component, and an interlayer connection conductor is located at a position overlapping with the second conductor to connect the mounting terminal of the second electronic component to the second conductor;
the first insulating base member is disposed with the main surface including the first conductor abutting on the second insulating base member in the lamination direction;
the second insulating base member is disposed with the main surface including the second conductor abutting on the first insulating base member in the lamination direction;
and
the first insulating base member and the second insulating base member are heat-pressure-bonded.

9 more elements

A method for manufacturing a component incorporating substrate, the method comprising the steps of:

preparing a plurality of thermosetting insulating base members each including a conductor on only one surface thereof, the plurality of insulating base members including a first insulating base member including a first conductor only on one surface thereof and a second insulating base member including a second conductor only on one surface thereof;
forming a through hole at a position overlapping with the first conductor, in the first insulating base member, and filling the through hole with electrically-conductive paste;
forming a through hole at a position overlapping with the second conductor, in the second insulating base member, and filling the through hole with electrically-conductive paste;
laminating the plurality of insulating base members in a lamination direction such that a first conductor-less surface which is opposite to the main surface including the first conductor of the first insulating base member abuts a mounting terminal-exposed surface of a first electronic component, a second conductor-less surface which is opposite to the main surface including the second conductor of the second insulating base member abuts a mounting terminal-exposed surface of a second electronic component, the main surface including the first conductor of the first insulating base member abuts the second insulating base member, and the main surface including the second conductor of the second insulating base member abuts the first insulating base member;
and
heating the laminated plurality of insulating base members under pressure applied in the lamination direction.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/372,440Filed 8 Dec 2016 · continuation
Priority: JP 2014-12819323 Jun 2014
Published: US 2017/0094798 A130 Mar 2017
Granted: 26 Dec 2017
Term ends: Not estimatedThe source records don’t support an estimate.

Classification17 codes

H05K 1/188
Associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of…:…
H05K 1/0313
Use of materials for the substrate: organic insulating material
H05K 1/09
Details: use of materials for the conductive, e.g. metallic pattern
H05K 1/115
Printed elements for providing electric connections to or between printed circuits: via connections; Lands around holes or via connections