Component-embedded substrate

A component-embedded substrate comprising:

• a resin substrate having a mount surface and a peripheral surface surrounding a perimeter of said mount surface;
• a first mounted component mounted on said mount surface;
• a second mounted component mounted on said mount surface and spaced from said first mounted component;
• and
• at least one first embedded electronic component chip disposed in said resin substrate,
• said first embedded electronic component chip being located close to the peripheral surface of said resin substrate,
• said mount surface including:
• a first region located between said first mounted component and said second mounted component and extending in a cross direction crossing an arrangement direction in which said first mounted component and said second mounted component are arranged with respect to each other;
• and
• a second region located outside said first region,
• said first embedded electronic component chip being arranged to extend in said first region and said second region as viewed in a direction perpendicular to said mount surface,
• wherein said first embedded electronic component chip is located relatively closer to the peripheral surface of said resin substrate as compared with said first mounted component and said second mounted component,
• wherein at least one of the first mounted component and the second mounted component comprises a chip component,
• wherein said peripheral surface includes a first side surface and a second side surface opposite to said first side surface, said first and second side surfaces being located with respect to each other along said cross direction, and
• wherein said first embedded electronic component chip includes a first electronic component located relatively closer to said first side surface as compared with said second mounted component, and a second electronic component chip located relatively closer to said second side surface as compared with said first mounted component.

A component-embedded substrate comprising:

• a resin substrate having a mount surface and a peripheral surface surrounding a perimeter of said mount surface;
• a first mounted component mounted on said mount surface;
• a second mounted component mounted on said mount surface and spaced from said first mounted component;
• and
• at least one first embedded electronic component chip disposed in said resin substrate,
• said first embedded electronic component chip being located close to the peripheral surface of said resin substrate,
• said mount surface including:
• a first region located between said first mounted component and said second mounted component and extending in a cross direction crossing an arrangement direction in which said first mounted component and said second mounted component are arranged with respect to each other;
• and
• a second region located outside said first region,
• said first embedded electronic component chip being arranged to extend in said first region and said second region as viewed in a direction perpendicular to said mount surface,
• wherein said first embedded electronic component chip is located relatively closer to the peripheral surface of said resin substrate as compared with said first mounted component and said second mounted component,
• wherein at least one of the first mounted component and the second mounted component comprises a chip component,
• wherein said resin substrate has a lower surface located opposite to said mount surface, and
• wherein said first embedded electronic component chip is located relatively closer to said mount surface than to said lower surface.