Multilayer substrate

#The present disclosure relates to a multilayer substrate.

#There is a case in which an electronic component is incorporated in a multilayer substrate formed by stacking in layers resin films made of thermoplastic resin. An invention in which stress acting on an electronic component incorporated in such a multilayer substrate is reduced for the purpose of suppressing damage to the electronic component is described in Japanese Patent Laying-Open No. 2008-141007 (patent document 1). In patent document 1, some of a plurality of resin films forming the multilayer substrate is provided with a throughhole for inserting the electronic component therethrough.

#PTD 1: Japanese Patent Laying-Open No. 2008-141007

#FIG. 1 is a cross section of a multilayer substrate in a first embodiment based on the present disclosure.

#FIG. 2 is a perspective view of the multilayer substrate in the first embodiment based on the present disclosure, as seen at a lower surface thereof.

#FIG. 3 is a perspective view of a supplementary member included in the multilayer substrate in the first embodiment based on the present disclosure.

#With reference to FIGS. 1-3, the following illustrates a multilayer substrate 101 in a first embodiment based on the present disclosure.

#As shown in FIG. 1, multilayer substrate 101 comprises: a stack 1 formed of a plurality of insulating base materials 2; a first component 31 arranged at a first level in a thickness direction of stack 1 within stack 1; a second component 32 arranged at a second level different from the first level within stack 1 and arranged so that, in a plan view, at least a portion of second component 32 overlaps a portion of first component 31; and a supplementary member 4 arranged so as to at least partly exist in a range which is, in a thickness direction, as high as or upper than a lower end of second component 32 and as high as or lower than an upper end of second component 32, and in a plan view, within a region which is within a projected area of first component 31 and does not overlap second component 32, a rigidness of supplementary member 4 being higher than that of insulating base materials 2.

#As shown in FIG. 1, multilayer substrate 101 may include a component 3 in addition to first component 31 and second component 32. Multilayer substrate 101 may include an interlayer connection conductor 6 and a conductive pattern 7 therein. In the example shown in FIG. 1, multilayer substrate 101 has a lowermost surface provided with an external electrode 18, however, this is only one example and whether external electrode 18 is present/absent, how many external electrodes 18 are provided, what shape external electrode 18 has, and the like are not limited in that way. For example, in addition to or instead of the external electrode at the lowermost surface, the external electrode may be provided at the topmost surface.