Module component
AssigneeMurata Manufacturing Co., Ltd.
InventorsShigeru Tago, Hirofumi Shinagawa, Masaki Kawata, Yuki Ito
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Abstract
A module component includes a substrate including a liquid crystal polymer resin sheet, and an electronic component mounted on the substrate by ultrasonic bonding, wherein the electronic component includes a plurality of first substrate connecting electrodes including respective planar conductors provided on a substrate mounting surface separately from each other, and connected at a same potential or substantially a same potential, and the substrate includes a first component connecting electrode including a planar conductor provided on a component loading surface, and bonded to the plurality of first substrate connecting electrodes.
Claims19
A module component comprising:
- a substrate including a thermoplastic resin base material;
- and
- an electronic component ultrasonically bonded on the substrate;
- wherein
- the electronic component includes a plurality of first substrate connecting electrodes including respective planar conductors provided on a substrate mounting surface separately from each other, and connected at a same potential or substantially a same potential;
- the substrate includes a first component connecting electrode including a planar conductor provided on a component loading surface, and bonded to the plurality of first substrate connecting electrodes;
- and
- the substrate has anisotropy of an elastic modulus in an in-plane direction on the component loading surface.
Dependencies are inferred from the claim text.