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US 9,854,674 B1Granted
Flexible printed circuit and printed circuit board soldered structure
AssigneeLuxnet Corporation
InventorsHo-I Chen, Yi-Ching Chiu, Bo-Wei Liu, Hsing-Yen Lin, Hua-Hsin Su
Life of this patent
Estimating the term…
Abstract
A flexible printed circuit and printed circuit board soldered structure is provided. The structure includes signal transmission lines which dispense with any through hole, thereby enhancing integrity of high-frequency signals. The special design of the signal line structure of the flexible printed circuit and the printed circuit board together provides a satisfactory high-frequency signal transmission interface and enables a soldering technique which is highly practicable and compatible with the flexible printed circuit and printed circuit board soldered structure.
Claims12
A flexible printed circuit and printed circuit board soldered structure, comprising:
- a flexible printed circuit comprising a soft board body, with a first signal pad region disposed on a side of the soft board body, and a first grounding pad region disposed on an opposing side of the soft board body, the first signal pad region comprising a pair of first differential signal transmission lines and two first grounding soldering portions flanking the pair of the first differential signal transmission lines, the first differential signal transmission lines having intact surfaces dispensing with any through hole, wherein ends of the first differential signal transmission lines are flush with an edge of the soft board body, with a through hole disposed on the first grounding soldering portion to electrically connect the first grounding soldering portion and the first grounding pad region, and an insulating region disposed on the first grounding pad region and corresponding in position to the first differential signal transmission lines on a side of the soft board body, the insulating region extending inward from an edge of the soft board body;
- and
- a printed circuit board comprising a substrate body, a second signal pad region disposed on a side of the substrate body, and a second grounding pad region disposed on an opposing side of the substrate body, the second signal pad region comprising a pair of second differential signal transmission lines and two second grounding soldering portions flanking the pair of second differential signal transmission lines, the second differential signal transmission lines having intact surfaces dispensing with any through hole, with a through hole disposed on the second grounding soldering portions to electrically connect the second grounding soldering portions and the second grounding pad region,
- wherein the flexible printed circuit is disposed on the printed circuit board, the insulating region of the first grounding pad region is disposed above the second differential signal transmission lines to stay away from the second differential signal transmission lines and thus preclude developing a short circuit together with the second differential signal transmission lines, and the ends of the first differential signal transmission lines are soldered to the second differential signal transmission lines from above by a solder to effectuate electrical connection.
1 more element
A flexible printed circuit and printed circuit board soldered structure, comprising:
- a flexible printed circuit comprising a soft board body, with a first signal pad region disposed on a side of the soft board body, and a first grounding pad region disposed on an opposing side of the soft board body, the first signal pad region comprising a first signal transmission line and two first grounding soldering portions flanking the first signal transmission line, the first signal transmission line having an intact surface dispensing with any through hole, wherein an end of the first signal transmission line is flush with an edge of the soft board body, with a through hole disposed on the first grounding soldering portion to electrically connect the first grounding soldering portion and the first grounding pad region, and an insulating region disposed on the first grounding pad region and corresponding in position to the first signal transmission line on a side of the soft board body, the insulating region extending inward from an edge of the soft board body;
- and
- a printed circuit board comprising a substrate body, a second signal pad region disposed on a side of the substrate body, and a second grounding pad region disposed on an opposing side of the substrate body, the second signal pad region comprising a second signal transmission line and two second grounding soldering portions flanking the second signal transmission line, the second signal transmission line having an intact surface dispensing with any through hole, with a through hole disposed on the second grounding soldering portions to electrically connect the second grounding soldering portions and the second grounding pad region,
- wherein the flexible printed circuit is disposed on the printed circuit board, the insulating region of the first grounding pad region is disposed above the second signal transmission line to stay away from the second signal transmission line and thus preclude developing a short circuit together with the second signal transmission line, and the end of the first signal transmission line is soldered to the second signal transmission line from above by a solder to effectuate electrical connection.
1 more element
Dependencies are inferred from the claim text.