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US 9,854,672 B2Granted
Printed circuit board and method of manufacturing a printed circuit board
AssigneeSamsung Display Co., Ltd.
InventorsJung-Hoon Ku, Yong-Woo Koo, Ki-Yong Kim
Life of this patent
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Abstract
A printed circuit board includes a substrate and a plurality of pad forming regions disposed thereon. The plurality of pad forming regions are spaced apart from each other by a predetermined distance. A plurality of connection pads are disposed on a portion of the plurality of pad forming regions. The plurality of connection pads are configured to transmit or receive a signal to an external device or from the external device. The printed circuit board includes a path configured for the transportation of moisture therein.
Claims15
A printed circuit board, comprising:
- a substrate having a plurality of pad forming regions disposed thereon, wherein the pad forming regions of the plurality of pad forming regions are spaced apart from each other by a predetermined distance;
- a plurality of connection pads disposed on a portion of the plurality of pad forming regions, wherein the plurality of connection pads is configured to transmit or receive a signal to an external device or from the external device;
- and
- a path formed directly above the substrate between at least two connection pads of the plurality of connection pads, the path configured for the transportation of moisture above the substrate and between the at least two connection pads of the plurality of connection pads, wherein the substrate overlaps a lower level of the path.
1 more element
A printed circuit board, comprising:
- a substrate having a plurality of pad forming regions disposed thereon, wherein the pad forming regions of the plurality of pad forming regions are spaced apart from each other by a predetermined distance;
- a plurality of connection pads disposed on a portion of the plurality of pad forming regions, wherein the plurality of connection pads is configured to transmit or receive a signal to an external device or from the external device;
- a path formed above the substrate between at least two connection pads of the plurality of connection pads, the path configured for the transportation of moisture above the substrate and between the at least two connection pads of the plurality of connection pads, wherein the substrate overlaps a lower level of the path;
- and
- a moisture absorbent disposed on the substrate below the path.
2 more elements
A display device, comprising:
- a printed circuit board, wherein the printed circuit board includes:
- a substrate having a plurality of pad forming regions, wherein the plurality of pad forming regions are spaced apart from each other by a predetermined distance, and a plurality of connection pads disposed on a portion of the plurality of pad forming regions, wherein the plurality of connection pads are configured to transmit or receive a signal to an external device or from the external device;
- a main printed circuit board electrically connected to the printed circuit board;
- a display panel electrically connected to the main printed circuit board via the printed circuit board;
- a path formed above the substrate between at least two connection pads of the plurality of connection pads, the path configured for the transportation of moisture above the substrate and between the at least two connection pads of the plurality of connection pads;
- and
- a moisture absorbent disposed on the substrate below the path.
4 more elements
A printed circuit board, comprising:
- a substrate comprising a plurality of connection pad forming regions and a plurality of non-connection pad forming regions;
- two or more connection pads disposed on the plurality of connection pad forming regions, but not on the plurality of non-connection pad forming regions, wherein the two or more connection pads is electrically connected to an external device;
- at least one path configured to transport moisture disposed on at least one of the plurality of non-connection pad forming regions, wherein the at least one path is formed above the substrate between adjacent connection pads of the two or more connection pads;
- and
- a moisture absorbent disposed on the substrate below the path.
2 more elements
Dependencies are inferred from the claim text.