Package substrate

A printed wiring board, comprising:

• a first resin insulating layer;
• a first conductor layer formed on a first surface of the first resin insulating layer;
• a second conductor layer formed on a second surface of the first resin insulating layer;
• a first via conductor structure formed in the first resin insulating layer such that the first via conductor structure is connecting the first conductor layer and the second conductor layer;
• a second resin insulating layer formed on the second surface of the first resin insulating layer such that the second conductor layer is embedded into the second resin insulating layer and that the first resin insulating layer is covering the second conductor layer;
• a third conductor layer formed on the second resin insulating layer;
• and
• a second via conductor structure formed in the second resin insulating layer such that the second via conductor structure is connecting the second conductor layer and the third conductor layer,
• wherein the first conductor layer is an outermost conductor layer and includes a plurality of primary pads and a plurality of secondary pads such that the primary pads are positioned to mount a first electronic component on the first surface of the first resin insulating layer and the secondary pads are positioned to mount a second electronic component on the first surface of the first resin insulating layer, and the second conductor layer includes a dedicated wiring layer configured to transmit data between the first and second electronic components to be mounted to the first surface of the first resin insulating layer.