Sliding thermal shield

An assembly for providing electromagnetic interference (EMI) shielding and for dissipating heat emitted from a plurality of electronic components inside the assembly and attached to a board, each electronic component having a height that extends above the board, each electronic component's height being equal to or greater than a first minimum height, the assembly comprising:

• a substantially rectangular metallic frame comprising a plurality of upwardly-extending side walls, each sidewall having a second height that is less than the first minimum height, said metallic frame surrounding said electronic components;
• an EMI shield configured to fit over the metallic frame, the EMI shield having a rectangular and substantially planar top (top) with a first area A1, the top being perforated by a plurality of holes, which are spaced apart from each other and uniformly distributed across the top, the top having a circumferential edge from which EMI shield side walls extend downwardly, each sidewall of the EMI shield having a height less than or equal to the second height, the sidewalls of the EMI shield being attachable to the frame sidewalls in a first latched position and attachable to the frame sidewalls in a second, un-latched position, the second, un-latched position being closer to the board than the first latched position, the top of the EMI shield being mechanically and electrically separated from the electronic components when the EMI shield is in the first latched position;
• a layer of thermally-conductive and viscous heat sink grease on the top surface of the EMI shield and filling a plurality of the holes in the top of the EMI shield, heat sink grease in the plurality of holes being in direct physical contact with the top surfaces of the electronic components surrounded by the frame, when the EMI shield is in the second, un-latched position;
• a heat sink on top of and in direct physical contact with the heat sink grease on top of the EMI shield but physically separated from the EMI shield;
• wherein, when the EMI shield is attached to the frame in the second latched position, electronic components within the frame are isolated from EMI originating outside the assembly and wherein EMI emitted from electronic components inside the assembly is contained therein, and wherein heat generated by the electronic components inside the assembly is conducted to the heat sink through the heat sink grease.

A method for providing board level electromagnetic interference (EMI) shielding and thermal management for one or more electronic components of a circuit board, the electronic components having heights that are different from each other, the method comprising:

• attaching to the circuit board, a metallic frame comprising a metallic side wall that encircles a plurality of electronic components, the side wall having a height less than the heights of the electronic components inside the frame;
• attaching an EMI shield to the metallic side wall of the frame in a first latched position such that a first distance separates the EMI shield and electronic components inside the frame, the EMI shield comprising a substantially planar top, which is perforated by a plurality of holes, which are uniformly spaced apart from each other;
• applying a layer of viscous, heat sink grease to the EMI shield;
• applying a heat sink to the layer of heat sink grease;
• and
• moving the heat sink downward toward the board, filling holes in the EMI shield with heat sink grease and driving he heat sink grease into direct physical contact with the electronic components.