Radio frequency module

A radio frequency module comprising:

• a stack of a plurality of insulating base material layers defining a multilayer circuit board including a cavity inside thereof;
• a component disposed in the cavity and including a noise generation source;
• and
• a ground conductive body disposed inside the multilayer circuit board;
• wherein
• the insulating base material layer is a layer made of a thermoplastic resin having flowability during heating and pressurizing;
• the ground conductive body is disposed on a layer not exposed to an inner surface of the cavity;
• the radio frequency module includes an inter-layer connection conductive body electrically connected to the ground conductive body but not electrically connected to a conductive body portion provided in the component and disposed at a position opposite to a local portion of the component, the inter-layer connection conductive body protruding in a direction of the cavity from the ground conductive body, and all portions of the inter-layer connection conductive body being covered by the component in a planar view in a stacking direction of the multilayer circuit board;
• the ground conductive body includes a first ground conductive body and a second ground conductive body both of which have a planar or linear shape;
• the inter-layer connection conductive body protrudes in a direction of the component from the first ground conductive body and connects the first ground conductive body to the second ground conductive body;
• and
• no inter-layer connection conductive body protrudes in a direction of the component from the second ground conductive body.