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US 9,853,678 B2Granted
Electronic device
AssigneeMediaTek Singapore Pte. Ltd.
InventorsJie Chen, Ting-Huan Lee, Jian Wu
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Abstract
Electronic devices are disclosed. The electronic device includes a circuit board. The circuit board contains a first transceiver module pad configured for soldering a first transceiver module thereon; and a second transceiver module pad configured for soldering a second transceiver module thereon. The first transceiver module is different from the second transceiver module, and layouts of the first and second transceiver module pads are the same.
Claims9
An electronic device, comprising:
- a circuit board, comprising:
- a first transceiver module pad, configured for soldering a first transceiver module thereon;
- and
- a second transceiver module pad, configured for soldering a second transceiver module thereon;
- wherein the first transceiver module is different from the second transceiver module, and layouts of the first and second transceiver module pads are the same, wherein the first transceiver module comprises 8 pads within a square frame, arranged in three columns, wherein the first column includes three pads disposed separately, the second column includes two pads disposed separately, and the third column includes three pads disposed separately.
2 more elements
An electronic device, comprising:
- a circuit board, comprising:
- a first transceiver module pad, configured for soldering a first transceiver module thereon;
- and
- a second transceiver module pad, configured for soldering a second transceiver module thereon;
- wherein the first transceiver module is different from the second transceiver module, and layouts of the first and second transceiver module pads are the same, wherein the first transceiver module comprises 9 pads within a square frame, arranged in three rows and three columns and disposed separately.
2 more elements
An electronic device, comprising:
- a circuit board, comprising:
- a first transceiver module pad, configured for soldering a first transceiver module thereon;
- and
- a second transceiver module pad, configured for soldering a second transceiver module thereon;
- wherein the first transceiver module is different from the second transceiver module, and layouts of the first and second transceiver module pads are the same, wherein the circuit board further comprising:
- a selection switch pad, configured for soldering a selection switch thereon;
- wherein the selection switch is compatible with different transceiver modules with same number of solder pads.
4 more elements
An electronic device, comprising:
- a baseband processing device, configured to perform baseband signal processing;
- an RF transceiver, coupled to the baseband processing device, configured to convert between a received baseband signal and an RF signal;
- a first transceiver module, coupled to the RF transceiver and an antenna module, configured to transmit and receive signals of a first type;
- and
- a second transceiver module, coupled to the RF transceiver and an antenna module, configured to transmit and receive signals of a second type,
- wherein a solder pad footprint of a solder pad for soldering the first transceiver module is the same as that for soldering the second transceiver module.
3 more elements
Dependencies are inferred from the claim text.