Acoustic wave device, transceiver device, and mobile communication device

An acoustic wave device comprising:

• an acoustic wave chip including an acoustic wave element formed therein;
• a multilayered substrate having the acoustic wave chip mounted on an upper surface thereof;
• a first ground terminal formed on a lower surface of the multilayered substrate and electrically coupled to a ground electrode of the acoustic wave chip;
• a second ground terminal formed on the lower surface of the multilayered substrate;
• a signal terminal formed on the lower surface of the multilayered substrate and electrically coupled to a signal electrode of the acoustic wave chip;
• a shield layer formed at least one of on the upper surface of the multilayered substrate, on the lower surface of the multilayered substrate, and on a layer between the lower surface and the upper surface of the multilayered substrate so as to overlap with at least a part of the acoustic wave chip, wherein the shield layer is not electrically coupled to the first ground terminal in the multilayered substrate, and is electrically coupled to the second ground terminal;
• and
• a pad formed on the upper surface of the multilayered substrate and bonded to the ground electrode,
• wherein the shield layer is formed on the upper surface of the multilayered substrate, the shield layer includes an aperture, and
• the pad is formed in the aperture.

An acoustic wave device comprising:

• an acoustic wave chip including an acoustic wave element formed therein;
• a multilayered substrate having the acoustic wave chip mounted on an upper surface thereof;
• a first ground terminal formed on a lower surface of the multilayered substrate and electrically coupled to a ground electrode of the acoustic wave chip;
• a second ground terminal formed on the lower surface of the multilayered substrate;
• a signal terminal formed on the lower surface of the multilayered substrate and electrically coupled to a signal electrode of the acoustic wave chip;
• and
• a shield layer formed at least one of on the upper surface of the multilayered substrate, on the lower surface of the multilayered substrate, and on a layer between the lower surface and the upper surface of the multilayered substrate so as to overlap with at least a part of the acoustic wave chip, wherein the shield layer is not electrically coupled to the first ground terminal in the multilayered substrate, and is electrically coupled to the second ground terminal,
• wherein the acoustic wave chip includes acoustic wave chips, and
• the shield layer is formed so as to overlap with the acoustic wave chips.