Integrated circuit (IC) package comprising electrostatic discharge (ESD) protection

The A package comprising:

• a die;
• a package substrate coupled to the die;
• and
• a first electrostatic discharge (ESD) protection component coupled to the package substrate, wherein the first electrostatic discharge (ESD) protection component is configured to provide package level electrostatic discharge (ESD) protection, wherein the first electrostatic discharge (ESD) protection component comprises:
• a first P+ layer;
• a first interconnect coupled to the first P+ layer;
• a first N+ layer;
• a second P+ layer;
• a second interconnect coupled to the first N+ layer and the second P+ layer;
• a second N+ layer;
• a third interconnect coupled to the second N+ layer;
• a second P− layer that at least partially encapsulates the first P+ layer;
• a first N− layer that at least partially encapsulates the second P− layer and the first N+ layer;
• a second N− layer that at least partially encapsulates the second N+ layer;
• a first P− layer that at least partially encapsulates the first N− layer, the second P+ layer and the second N− layer;
• a first diode comprising the second P− layer and the first N− layer;
• and
• a second diode comprising the second N− layer and the first P− layer.