Carrier module with bridging element for a semiconductor element

A carrier module for at least one semiconductor element, comprising:

• at least one of a passively and/or actively cooled carrier, on which the at least one semiconductor element is positionable, having a positive carrier contact and a negative carrier contact;
• a bridging device, which is structured to bridge the at least one semiconductor element when positioned on the carrier, comprising at least one first printed circuit board with at least one bridging element and at least one initiation unit,
• wherein the at least one first printed circuit board comprises at least one positive contact, which is electrically conductively connected to the positive carrier contact and at least one negative contact, which is electrically conductively connected to the negative carrier contact,
• wherein the at least one bridging element is electrically conductively connected to the positive contact and to the negative contact of the at least one first printed circuit board,
• wherein the at least one first printed circuit board is thermally conductively and releasably connected to the carrier, and
• wherein, in an event of a high resistance defect at the semiconductor element, the initiation unit is connected to activate the bridging element so current bypasses the semiconductor element via the bridging element.