Connection structure for laser and laser assembly

A connection structure for a laser, comprising:

• a first insulation substrate, wherein the first insulation substrate comprises an upper surface and a lower surface, the upper surface comprising an upper conductive path and the lower surface comprising a lower conductive path:
• a second insulation substrate disposed on the upper surface of the first insulation substrate, wherein an upper surface of the second insulation substrate comprises a first conductive path and the first conductive path on the upper surface of the second insulation substrate is electrically connected to the lower conductive path on the lower surface of the first insulation substrate via a first through-hole;
• wherein the upper conductive path on the upper surface of the first insulation substrate comprises at least two conductive paths configured to a ground wire, and at least one conductive path that is configured to a signal line and disposed between the at least two conductive paths configured to the ground wire;
• the first insulation substrate is provided inside with a first conductive interlayer;
• the first conductive interlayer is a reference layer;
• and the reference layer is electrically connected to a second conductive path configured to the ground wire via a second through-hole;
• and
• wherein the lower conductive path on the lower surface of the first insulation substrate is disposed near an outer end of the lower surface of the first insulation substrate;
• a metal layer configured to weld to a laser housing is disposed near an inner end of the lower surface of the first insulation substrate;
• the metal layer and the lower conductive path on the lower surface of the first insulation substrate are disposed at an interval;
• a second conductive interlayer is further provided between the first conductive interlayer and the lower surface of the first insulation substrate;
• the second conductive interlayer comprises a plurality of conductive paths;
• the first conductive path on the upper surface of the second insulation substrate respectively correspond corresponds to and is electrically connected to the plurality of conductive paths of the second conductive interlayer via a third through-hole;
• and the plurality of conductive paths of the second conductive interlayer respectively correspond to and are electrically connected to the lower conductive path on the lower surface of the first insulation substrate via a fourth through-hole.

A laser assembly, comprising:

• a housing provided inside with a heat sink, the heat sink being provided with a laser, and
• a connection structure comprising:
• a first insulation substrate, wherein
• the first insulation substrate comprises an upper surface and a lower surface, the upper surface comprising an upper conductive path and the lower surface comprising a lower conductive path, and
• the lower conductive path on the lower surface of the first insulation substrate is disposed near an outer end of the lower surface of the first insulation substrate;
• a metal layer configured to weld to a laser housing and disposed near an inner end of the lower surface of the first insulation substrate;
• a second insulation substrate disposed on the upper surface of the first insulation substrate wherein:
• an upper surface of the second insulation substrate comprises a first conductive path, and
• the first conductive path on the upper surface of the second insulation substrate is electrically connected to the lower conductive path on the lower surface of the first insulation substrate via a first through-hole;
• and
• wherein an end of the connection structure is inserted into the housing, and a conductive path of the upper conductive path or the first conductive path of the connection structure is electrically connected to the laser in a wire bonding manner.