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US 9,853,242 B2Granted
Sealing structure and organic electroluminescence device
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorYusuke Nishido
Life of this patent
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Abstract
A sealing structure with high air-tightness and an organic electroluminescence device with high air-tightness are provided regardless of a pattern of a first metal layer overlapping with glass frit. A second metal layer is provided in a region where a common power supply line overlaps with the glass frit. Since laser light is absorbed or reflected by the second metal layer, the glass frit can be uniformly heated. Therefore, an object to be sealed can be sealed with a low-melting-point glass in which a crack is not easily generated.
Claims18
A sealing structure comprising:
- a first substrate;
- a second substrate facing with the first substrate;
- a sealant for sealing a space between the first substrate and the second substrate;
- a circuit portion inside the sealant;
- a plurality of first metal layers between the first substrate and the sealant;
- a second metal layer between the plurality of the first metal layers and the sealant, the second metal layer being provided between the circuit portion and an edge of the second substrate;
- and
- a first insulating layer between the plurality of the first metal layers and the second metal layer,
- wherein the plurality of the first metal layers and the second metal layer are electrically insulated from each other by the first insulating layer,
- wherein the sealant does not overlap with the circuit portion,
- wherein in a first region, the second metal layer and the sealant extend along the edge of the second substrate,
- wherein each of the plurality of the first metal layers intersects with the second metal layer and the sealant,
- wherein a width of the second metal layer is larger than a width of the sealant in the first region,
- wherein the width of the second metal layer and the width of the sealant are physical extent perpendicular to the edge of the second substrate, and
- wherein the sealant comprises glass.
12 more elements
An organic electroluminescence device comprising:
- a first substrate;
- a second substrate facing with the first substrate;
- a light-emitting element over the first substrate;
- a sealant between the first substrate and the second substrate and sealing the light-emitting element;
- a circuit portion inside the sealant;
- a plurality of the first metal layers between the first substrate and the sealant;
- a second metal layer between the plurality of the first metal layers and the sealant, the second metal layer being provided between the circuit portion and an edge of the second substrate;
- and
- a first insulating layer between the plurality of the first metal layers and the second metal layer,
- wherein the plurality of the first metal layers and the second metal layer are electrically insulated from each other by the first insulating layer,
- wherein the sealant does not overlap with the circuit portion,
- wherein in a first region, the second metal layer and the sealant extend along the edge of the second substrate,
- wherein each of the plurality of the first metal layers intersects with the second metal layer and the sealant,
- wherein a width of the second metal layer is larger than a width of the sealant in the first region,
- wherein the width of the second metal layer and the width of the sealant are physical extent perpendicular to the edge of the second substrate, and
- wherein the sealant comprises glass.
13 more elements
An organic electroluminescence device comprising:
- a first substrate;
- a second substrate facing with the first substrate;
- a light-emitting element over the first substrate;
- a sealant between the first substrate and the second substrate and sealing the light-emitting element;
- a circuit portion inside the sealant;
- a plurality of first metal layers between the first substrate and the sealant;
- a second metal layer between the plurality of the first metal layers and the sealant, the second metal layer being provided between the circuit portion and an edge of the second substrate;
- a first insulating layer between the plurality of the first metal layers and the second metal layer,
- a second insulating layer over and in contact with the second metal layer;
- and
- a third insulating layer over the second insulating layer,
- wherein the plurality of the first metal layers and the second metal layer are electrically insulated from each other by the first insulating layer,
- wherein the sealant is in contact with the second insulating layer through a groove in the third insulating layer,
- wherein in a first region, the second metal layer and the sealant extend along the edge of the second substrate,
- wherein each of the plurality of the first metal layers intersects with the second metal layer and the sealant,
- wherein a width of the second metal layer is larger than a width of the sealant in the first region,
- wherein the width of the second metal layer and the width of the sealant are physical extent perpendicular to the edge of the second substrate, and
- wherein the sealant comprises glass.
15 more elements
Dependencies are inferred from the claim text.