MEMS component and method for encapsulating MEMS components

A Microelectromechanical Systems (MEMS) component comprising:

• a substrate having an active surface with electrical component structures and contact areas;
• metallic column structures located on the contact areas;
• a metallic frame structure arranged on the active surface of the substrate and enclosing the electrical component structures and the metallic column structures;
• a resist layer seated on the metallic frame structure and the metallic column structures such that the substrate, the metallic frame structure and the resist layer form an enclosed cavity, wherein selected ones of the metallic column structures penetrate through the resist layer such that surfaces of the selected metallic column structures that face away from the substrate are not covered by the resist layer;
• and
• a structured metallization arranged over a surface of the resist layer that faces away from the substrate, wherein the structured metallization forms at least structured external contacts for making contact for the MEMS component and is electrically conductively connected to the surfaces of the metallic column structures.

A Microelectromechanical Systems (MEMS) component comprising:

• a substrate having an active surface with electrical component structures and contact areas;
• metallic column structures located on the contact areas;
• a metallic frame structure arranged on the active surface of the substrate and enclosing the electrical component structures and the metallic column structures;
• a resist layer seated on the metallic frame structure and the metallic column structures such that the substrate, the metallic frame structure and the resist layer form an enclosed cavity, wherein the resist layer has an interface with the enclosed cavity;
• and
• a structured metallization arranged over a surface of the resist layer that faces away from the substrate, wherein the structured metallization forms at least structured external contacts for making contact for the MEMS component and is electrically conductively connected to the metallic column structures.