Optoelectronic component and method of producing same
AssigneeOSRAM Opto Semiconductors GmbH
InventorsMichael Zitzlsperger, Christian Ziereis, Tobias Gebuhr
Life of this patent
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Abstract
An optoelectronic component includes a housing including a plastic material and a first lead frame section at least partly embedded in the plastic material, a first recess and a second recess, wherein a first upper section of an upper side of the first lead frame section is not covered by the plastic material in the first recess, a second upper section of the upper side of the first lead frame section is not covered by the plastic material in the second recess, the first recess and the second recess are separated from one another by a section of the plastic material, an optoelectronic semiconductor chip is arranged in the first recess, and no optoelectronic semiconductor chips is arranged in the second recess.
Claims13
An optoelectronic component comprising a housing comprising a plastic material and a first lead frame section at least partially embedded in the plastic material, and
- a first recess and a second recess,
- wherein a first upper section of an upper side of the first lead frame section is not covered by the plastic material in the first recess,
- a second upper section of the upper side of the first lead frame section is not covered by the plastic material in the second recess,
- the first recess and the second recess are separated from one another by a section of the plastic material,
- an optoelectronic semicondustor chip is arranged in the first recess, and
- no optoelectronic semicondustor chip and no bond wire are arranged in the second recess.
A method of producing an optoelectronic component comprising:
- arranging a lead frame in a molding tool, a first part of the molding tool bearing on a first upper section of an upper side of the lead frame;
- a second part, separated from the first part, of the molding tool bearing on a second upper section of the upper side of the lead frame;
- embedding the lead frame in a plastic material;
- and
- arranging an optoelectronic semiconductor chip only on the first upper section of the upper side of the lead frame, but not on the second upper section.
A method of producing an optoelectronic component comprising:
- arranging a lead frame in a molding tool, a first part of the molding tool bearing on a first upper section of an upper side of the lead frame;
- a second part, separated from the first part, of the molding tool bearing on a second upper section of the upper side of the lead frame;
- embedding the lead frame in a plastic material;
- and
- arranging an optoelectronic semiconductor chip only on the first upper section of the upper side of the lead frame, but not on the second upper section, wherein no bond wire is connected to the second upper section.
Dependencies are inferred from the claim text.