Apparatus and method for manufacturing thin film encapsulation

A method of manufacturing a thin film encapsulation, the method comprising:

• forming, in a first cluster comprising a plurality of first process chambers, a first inorganic layer on an opposite electrode and a pixel defining layer of a display substrate using a sputtering process, the first inorganic layer contacting the opposite electrode;
• forming, in a second cluster comprising a plurality of second process chambers, a first organic layer on the first inorganic layer using a monomer deposition process;
• and
• inverting the display substrate after forming the first organic layer and forming, in a third cluster comprising a plurality of third process chambers, a second inorganic layer on the first organic layer using a chemical vapor deposition (CVD) process or a plasma enhanced chemical vapor deposition (PECVD) process,
• wherein an order of the plurality of first process chambers, the plurality of second process chambers, and the plurality of third process chambers are arranged along one direction, and the first inorganic layer, the first organic layer, and the second inorganic layer are formed in the first, second, and third process chambers, respectively, in the same order.