Wafer level curved image sensors and method of fabricating the same
AssigneeSK hynix Inc.
InventorsYun-Hui Yang, Sung-Bo Hwang, Young-Hun Choi
Life of this patent
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Abstract
A wafer level curved image sensor may include a substrate having a central region, a peripheral region, and an edge region, the peripheral region being formed between the central region and the edge region, supporting patterns formed over the substrate, first fixed patterns formed between the supporting patterns, and an image sensing chip formed over the supporting patterns. The supporting patterns and the first fixed patterns, in combination, form a planar lower surface and a concavely-curved upper surface. The image sensing chip has a curved lower surface and a curved upper surface.
Claims19
A wafer level curved image sensor, comprising:
- supporting patterns formed over a substrate;
- first fixed patterns formed between the supporting patterns;
- and
- an image sensing chip formed over the supporting patterns,
- wherein the supporting patterns and the first fixed patterns, in combination, form a planar lower surface and a concavely-curved upper surface,
- wherein the image sensing chip has a curved lower surface and a curved upper surface, and
- wherein a pattern density of the supporting patterns in a central region of the substrate is lower than a pattern density of the supporting patterns in a peripheral region of the substrate.
A wafer level curved image sensor, comprising:
- a substrate having a planar upper surface;
- supporting patterns formed over the planar upper surface of the substrate;
- lower fixed patterns formed between the supporting patterns;
- an image sensing chip formed over the supporting patterns and the lower fixed patterns;
- and
- peripheral fixed patterns vertically extending through the image sensing chip and the supporting patterns to contact the planar upper surface of the substrate,
- wherein the supporting patterns and the lower fixed patterns, in combination, form a planar lower surface and a concavely-curved upper surface.
A wafer level curved image sensor, comprising:
- a lower substrate having a central region, a peripheral region surrounding the central region, and an edge region surrounding the peripheral region;
- supporting patterns formed over the lower substrate;
- lower fixed patterns formed between the supporting patterns;
- an image sensing chip formed over the supporting patterns and the lower fixed patterns;
- and
- peripheral fixed patterns formed in the peripheral region and vertically extending through the image sensing chip and the supporting patterns to contact the lower substrate,
- wherein the supporting patterns and the lower fixed patterns, in combination, form a concavely curved upper surface in the central and peripheral regions,
- wherein the image sensing chip has a concavely curved upper surface in the central and peripheral regions,
- wherein the supporting patterns, in combination, form a planar upper surface in the edge region, and
- wherein the image sensing chip has a planar upper surface in the edge region.
Dependencies are inferred from the claim text.