Semiconductor memory device
AssigneeToshiba Memory Corporation
InventorsTomoya Kawai, Tsutomu Tezuka
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AssigneeToshiba Memory Corporation
InventorsTomoya Kawai, Tsutomu Tezuka
Estimating the term…
A semiconductor memory device according to an embodiment includes: a semiconductor substrate; a plurality of first insulating layers and first conductive layers stacked alternately in a first direction above the semiconductor substrate; a first semiconductor layer extending in the first direction; and a memory layer disposed between one of the first insulating layers and the first semiconductor layer and between one of the first conductive layers and the first semiconductor layer, the memory layer including a charge accumulation layer, the first semiconductor layer and the memory layer having a gap, between one of the first insulating layers and the first semiconductor layer, and the first semiconductor layer and the memory layer being contacted each other, between one of the first conductive layers and the first semiconductor layer.
A semiconductor memory device, comprising:
A semiconductor memory device, comprising:
Dependencies are inferred from the claim text.