Methods of forming patterns, and apparatuses comprising FinFETs
AssigneeMicron Technology, Inc.
InventorWerner Juengling
Life of this patent
Estimating the term…
Loading patent…
AssigneeMicron Technology, Inc.
InventorWerner Juengling
Estimating the term…
Some embodiments include a method of forming a pattern. A semiconductor substrate has first and second rows extending along a first direction, and which alternate with one another along a second direction. Each of the rows includes course regions that are to be included along patterned structures. The course regions within the first rows are staggered relative to the course regions within the second rows. The patterned structures comprise first segments which extend along a third direction, and comprise second segments which extend along a fourth direction different from the third direction. Patterned masking material is formed across the substrate to define a first pattern having the first segments of the patterned structures, and to define a second pattern having the second segments of the patterned structures. The patterned structures are formed within the first and second patterns defined by the patterned masking material. Some embodiments include apparatuses having finFETs.
A method of forming a pattern, comprising:
A method of forming a pattern, comprising:
A method of forming a pattern, comprising:
An apparatus, comprising:
An apparatus, comprising:
Dependencies are inferred from the claim text.