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US 9,853,014 B2Granted
Electronic component, electronic apparatus, and method of manufacturing electronic apparatus
AssigneeFujitsu Limited
InventorsRyo Kikuchi, Nobuhiro Imaizumi, Hiroshi Onuki
Life of this patent
Estimating the term…
Abstract
An electronic component includes a substrate configured to include a first portion that first thermal conductivity, and have a first surface and a second surface opposite to the first surface; a second portion configured to be formed inside the first portion, and have second thermal conductivity lower than the first thermal conductivity; a first terminal configured to be formed to correspond to the second portion on a side of the first surface; and a second terminal configured to be formed on a side of the second surface.
Claims19
An electronic component comprising:
- a substrate configured to include a first portion that first thermal conductivity, and have a first surface and a second surface opposite to the first surface;
- a first wiring layer provided on the first surface;
- a second wiring layer provided on the second surface;
- a second portion configured to be formed inside the first wiring layer, and have second thermal conductivity lower than the first thermal conductivity;
- a first terminal configured to be formed to correspond to the second portion on a side of the first surface;
- a second terminal configured to be formed on a side of the second surface;
- and
- a vias provided side by side with the second portion in a horizontal direction and configured to penetrate the substrate between the first surface and the second surface and couple a first conductor portion in the first wiring layer and a second conductor portion in the second wiring layer.
5 more elements
An electronic apparatus comprising:
- a first electronic component configured to include:
- a first substrate configured to include a first portion having first thermal conductivity, and have a first surface and a second surface opposite to the first surface
- a first wiring layer provided on the first surface;
- a second wiring layer provided on the second surface;
- a second portion configured to be formed inside the first wiring layer, and have second thermal conductivity lower than the first thermal conductivity;
- a first terminal configured to be formed to correspond to the second portion on a side of the first surface;
- a second terminal configured to be formed on a side of the second surface of the first substrate opposite to the first surface;
- and
- a vias provided side by side with the second portion in a horizontal direction and configured to penetrate the substrate between the first surface and the second surface and couple a first conductor portion in the first wiring layer and a second conductor portion in the second wiring layer;
- and
- a second electronic component configured to include a third terminal coupled to the second terminal.
8 more elements
A method of manufacturing an electronic apparatus, the method comprising:
- facing a second terminal of a first electronic component to a third terminal of a second electronic component, the first electronic component configured to include:
- a first substrate which includes a first portion which has first thermal conductivity;
- a first wiring layer provided on the first surface of the first substrate;
- a second wiring layer provided on the second surface of the first substrate;
- a second portion which is formed inside the first wiring layer and has second thermal conductivity lower than the first thermal conductivity;
- a first terminal which is formed to correspond to the second portion on a side of a first surface of the first substrate;
- a second terminal which is formed on a side of a second surface of the first substrate opposite to the first surface;
- and
- a vias provided side by side with the second portion in a horizontal direction and configured to penetrate the substrate between the first surface and the second surface and couple a first conductor portion in the first wiring layer and a second conductor portion in the second wiring layer;
- and
- coupling the third terminal and the second terminal by executing heating from a side of the second electronic component.
8 more elements
Dependencies are inferred from the claim text.