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US 9,853,011 B2Granted
Semiconductor package structure and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorWen-Long Lu
Life of this patent
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Abstract
A semiconductor package structure includes a conductive structure, a semiconductor element disposed on and electrically connected to the conductive structure, a supporting structure, an encapsulant, and a metal layer. The supporting structure is disposed on the conductive structure and surrounds the semiconductor element. The encapsulant covers the semiconductor element. The metal layer is disposed on or embedded in the encapsulant.
Claims20
A semiconductor package structure, comprising:
- a conductive structure;
- a semiconductor element disposed on and electrically connected to the conductive structure;
- a supporting structure disposed on the conductive structure and surrounding the semiconductor element;
- an encapsulant covering the semiconductor element;
- and
- a metal layer disposed on or embedded in the encapsulant, wherein the metal layer is electrically insulated from the conductive structure.
3 more elements
A semiconductor package structure, comprising:
- a conductive structure including at least one insulation layer and at least one circuit layer;
- a supporting structure disposed on the conductive structure and defining at least one through hole;
- at least one semiconductor element disposed in the through hole and electrically connected to the conductive structure;
- an encapsulant covering the semiconductor element;
- and
- at least one upper element disposed on or embedded in the encapsulant, wherein a coefficient of thermal expansion of the upper element is in a range of variation less than or equal to ±20% of a coefficient of thermal expansion of the circuit layer, and a bending modulus of the upper element is in a range of variation less than or equal to ±35% of a bending modulus of the circuit layer.
3 more elements
Dependencies are inferred from the claim text.