Method for producing an integrated circuit package and apparatus produced thereby

An integrated circuit package having a fine pitch integrated circuit package design defined with respect to a grid having a plurality of ball locations arranged in a plurality of concentric annular rows, the integrated circuit package for connecting to a printed circuit board, and the package comprising:

• an outer row of via-connected solder balls in the plurality of concentric annular rows;
• a first inner row of via-connected solder balls in the plurality of concentric annular rows;
• a row of test pads in the plurality of concentric annular rows, the row of test pads comprising a plurality of test pads, the row of test pads being adjacent the outer row of via-connected solder balls to define a first inter-row region between the outer row of via-connected solder balls and the row of test pads, the row of test pads also being adjacent the first inner row of via-connected solder balls to define a second inter-row region between the first inner row of via-connected solder balls and the row of test pads;
• and,
• a second inner row of via-connected solder balls in the plurality of concentric annular rows, the second inner row being adjacent the first inner row in a direction opposite the row of test pads to define a third inter-row region between the first and second inner rows of via-connected solder balls,
• the first, second and third inter-row regions each having a substantially equal annular thickness, and
• the outer and inner rows of via-connected solder balls each connected to vias of the printed circuit board when the package is connected to the printed circuit board.