Interconnections for a substrate associated with a backside reveal

A method, comprising:

• obtaining a substrate having a post extending therefrom;
• the post including a conductor member;
• an upper portion of the post extending above an upper surface of the substrate;
• depositing a dielectric layer over the upper surface of the substrate and the upper portion of the post;
• an exterior surface of the post associated with the upper portion being in contact with the dielectric layer;
• the dielectric layer being disposed on the upper surface of the substrate and adjacent to the post to provide a dielectric collar for the post;
• depositing a conductor layer over the dielectric layer;
• an exterior surface of the dielectric collar being in contact with the conductor layer;
• the conductor layer being disposed adjacent to the dielectric collar to provide a metal collar for the post entirely above the uppermost surface of the substrate;
• a top surface of the conductive member being higher than a portion of the conductor layer;
• etching the conductor layer and the dielectric layer to provide an opening and to expose the top surface of the conductor member;
• depositing a bonding material into the opening, onto the top surface of the conductive member, onto a top surface of the dielectric collar, and onto a top surface of the metal collar;
• and
• the top surface of each of the conductor member, the dielectric collar and the metal collar having formed thereon a bond structure formed of the bonding material for interconnection of the metal collar and the conductor member.