Back to results
US 9,852,998 B2Granted
Ring structures in device die
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYing-Ju Chen, Jie Chen, Hsien-Wei Chen
Life of this patent
Estimating the term…
Abstract
A die includes a metal pad, a passivation layer over the metal pad, and a polymer layer over the passivation layer. A metal pillar is over and electrically coupled to the metal pad. A metal ring is coplanar with the metal pillar. The polymer layer includes a portion coplanar with the metal pillar and the metal ring.
Claims20
A structure comprising:
- a die comprising:
- a first metal pad;
- a passivation layer over the first metal pad;
- a polymer layer over the passivation layer;
- a metal pillar over and electrically coupled to the first metal pad;
- and
- a metal ring coplanar with the metal pillar, wherein the polymer layer comprises a first portion coplanar with the metal pillar and the metal ring, wherein in a top view of the die, the metal ring encircles a portion of the polymer layer.
4 more elements
A structure comprising:
- a die comprising:
- a first metal pad;
- a second metal pad coplanar with the first metal pad, wherein the second metal pad forms a ring encircling the first metal pad;
- a passivation layer over the first metal pad and the second metal pad, with the passivation layer comprising an opening aligned to a center portion of the first metal pad;
- a polymer layer over the passivation layer;
- a metal pillar over and electrically coupled to the first metal pad;
- a metal ring coplanar with the metal pillar, with the metal ring encircling the metal pillar, wherein the metal ring overlaps the second metal pad;
- and
- a seal ring underlying and overlapped by the metal ring;
- a molding material surrounding the die, wherein a top surface of the molding material is coplanar with a first top surface of the metal pillar and a second top surface of the metal ring;
- a dielectric layer over and in contact with the molding material;
- and
- redistribution lines in the dielectric layer and electrically coupled to the metal pillar, wherein an entirety of the metal ring is covered by the dielectric layer.
10 more elements
A structure comprising:
- a device die comprising a metal ring proximal peripherals of the device die, wherein the metal ring is either electrically floating or electrically grounded;
- through-vias at a same level as the device die;
- an encapsulating material encapsulating the device die therein;
- and
- a polymer layer in contact with the encapsulating material, the through-via, and the metal ring.
2 more elements
Dependencies are inferred from the claim text.