Conductive terminal on integrated circuit

A conductive terminal on an integrated circuit, comprising:

• a conductive pad disposed on and electrically to the integrated circuit;
• a dielectric layer covering the integrated circuit and the conductive pad, the dielectric layer comprising a plurality of arc-shaped contact openings, and the conductive pad being partially exposed by the arc-shaped contact openings;
• and
• a conductive via disposed on the dielectric layer and electrically connected to the conductive pad through the arc-shaped contact openings, the conductive via comprising a plurality of convex portions, the convex portions being distributed on a top surface of the conductive via, and the convex portions being corresponding to the dielectric layer covered by the conductive via, wherein the arc-shaped contact openings are separated from one another and arranged along a circular path, and a center of circle of the circular path is substantially aligned with a center of the conductive via.

A conductive terminal on an integrated circuit, comprising:

• a conductive pad disposed on and electrically to the integrated circuit;
• a dielectric layer covering the integrated circuit and the conductive pad, the dielectric layer comprising a ring-shaped contact opening, and the conductive pad being partially exposed by the ring-shaped contact opening;
• and
• a conductive via disposed on the dielectric layer and electrically connected to the conductive pad through the ring-shaped contact opening, the conductive via comprising at least one convex portion, the at least one convex portion being distributed on a top surface of the conductive via, and the at least one convex portion being corresponding to the dielectric layer covered by the conductive via, wherein an area of the at least one convex portion ranges from about 39% to about 75% of an area occupied by the conductive via.