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US 9,852,977 B2Granted
Package substrate
AssigneePhoenix Pioneer Technology Co., Ltd.
InventorsChun-Hsien Yu, Pao-Hung Chou
Life of this patent
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Abstract
This disclosure provides a package substrate which includes a rigid dielectric material layer, a first wiring layer having at least one first metal wire formed on the rigid dielectric material layer, and a first flexible dielectric material layer formed on the first wiring layer.
Claims16
A package substrate comprising:
- a rigid epoxy molding compound (EMC) layer;
- a first wiring layer having at least one first metal wire formed on the rigid EMC layer;
- and
- a first flexible dielectric material layer formed on the first wiring layer, wherein said first flexible dielectric material layer defines an outermost surface of said package substrate, and said first flexible dielectric material layer comprises an opening providing external access to said first metal wire.
1 more element
A package substrate comprising:
- a first flexible dielectric material layer, defining an outermost surface of said package substrate and comprising an opening;
- a first wiring layer having at least one first metal wire formed on the first flexible dielectric material layer, wherein said first metal wire is externally accessible through said opening;
- a multi-layered dielectric layer formed on the first wiring layer;
- a second wiring layer having at least one second metal wire formed on the multi-layered dielectric layer;
- and
- a second flexible dielectric material layer formed on the second wiring layer;
- wherein the multi-layered dielectric layer comprises a first epoxy molding compound (EMC)material layer, a third flexible dielectric material layer formed on the first rigid dielectric material layer, and a second EMC material layer formed on the third flexible dielectric material layer.
4 more elements
Dependencies are inferred from the claim text.