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US 9,852,975 B2Granted
Wiring board, electronic device, and electronic module
AssigneeKYOCERA Corporation
InventorYukio Morita
Life of this patent
Estimating the term…
Abstract
A wiring board according to the present invention includes: an insulating base including a main face, a side face, and a notch portion opened in the main face and the side face; and an inner-face electrode disposed on the inner face of the notch portion and to be connected to an external circuit board with solder therebetween. In such a wiring board, the inner-face electrode contains nickel and gold at a surface portion thereof, more nickel than gold at a surface in an outer periphery section, and more gold than nickel at a surface in an inner region.
Claims8
A wiring board comprising:
- an insulating base comprising a main face;
- a side face;
- a notch portion opened in the main face and the side face;
- and
- an inner-face electrode disposed on an inner face of the notch portion and to be connected to an external circuit board with solder therebetween,
- wherein, the inner-face electrode contains:
- nickel and gold at a surface portion thereof;
- more nickel than gold at a surface in an outer periphery section;
- and
- more gold than nickel at a surface in an inner region.
7 more elements
Dependencies are inferred from the claim text.