Substrate, light-emitting device with substrate, method of manufacturing substrate assembly and method of manufacturing light-emitting device with substrate

A substrate comprising:

• a first electrode layer comprising a first electrode and a second electrode;
• a second electrode layer comprising a first electrode and a second electrode;
• a third electrode layer comprising a first electrode and a second electrode;
• and
• a resin layer, wherein
• the first electrode layer is arranged on a first side of the resin layer, and the third electrode layer is arranged on a second side that is an opposite side of the first side of the resin layer,
• the second electrode layer is positioned in the resin layer,
• the first electrode layer is greater in thickness than the second electrode layer,
• the first electrode and the second electrode of the first electrode layer are positioned inside a peripheral edge of the first side of the resin layer,
• the first electrode and the second electrode of the third electrode layer are positioned inside a peripheral edge of the second side of the resin layer,
• the first electrode of the first electrode layer, the first electrode of the second electrode layer, and the first electrode of the third electrode layer are electrically connected to one another through filled vias, and
• a number of the filled vias that electrically connect the first electrode of the first electrode layer and the first electrode of the second electrode layer is greater than a number of filled vias that electrically connect the second electrode of the first electrode layer and the second electrode of the second electrode layer.

A substrate comprising:

• a first electrode layer comprising a first electrode and a second electrode;
• a second electrode layer comprising a first electrode and a second electrode;
• a third electrode layer comprising a first electrode and a second electrode;
• a resin layer;
• and
• an electroplated coating, wherein
• the first electrode layer is arranged on a first side of the resin layer, and the third electrode layer is arranged on a second side that is an opposite side of the first side of the resin layer,
• the second electrode layer is positioned in the resin layer,
• the first electrode layer is greater in thickness than the second electrode layer,
• the first electrode and the second electrode of the first electrode layer are positioned inside a peripheral edge of the first side of the resin layer,
• the first electrode and the second electrode of the third electrode layer are positioned inside a peripheral edge of the second side of the resin layer, and
• the electroplated coating separately covers the first electrode and the second electrode of the first electrode layer.

A substrate comprising:

• a first electrode layer comprising a first electrode and a second electrode;
• a second electrode layer comprising a first electrode and a second electrode;
• a third electrode layer comprising a first electrode and a second electrode;
• a resin layer;
• a first electroplated coating;
• and
• a second electroplated coating, wherein
• the first electrode layer is arranged on a first side of the resin layer, and the third electrode layer is arranged on a second side that is an opposite side of the first side of the resin layer,
• the second electrode layer is positioned in the resin layer,
• the first electrode layer is greater in thickness than the second electrode layer,
• the first electrode and the second electrode of the first electrode layer are positioned inside a peripheral edge of the first side of the resin layer,
• the first electrode and the second electrode of the third electrode layer are positioned inside a peripheral edge of the second side of the resin layer,
• the first electroplated coating is positioned at the first side of the resin layer and covers the first electrode of the first electrode layer and filled vias that are configured to electrically connect the first electrode of the first electrode layer and the first electrode of the second electrode layer, and
• the second electroplated coating is positioned at the first side of the resin layer and covers the second electrode of the first electrode layer and filled vias that are configured to electrically connect the second electrode of the first electrode layer and the second electrode of the second electrode layer.

A light-emitting device comprising:

• a light-emitting element;
• and
• a substrate comprising:
• a first electrode layer comprising a first electrode and a second electrode;
• a second electrode layer comprising a first electrode and a second electrode;
• a third electrode layer comprising a first electrode and a second electrode;
• a resin layer;
• and
• an electroplated coating covering the first electrode of the first electrode layer, wherein
• the first electrode layer is arranged on a first side of the resin layer, and the third electrode layer is arranged on a second side that is an opposite side of the first side of the resin layer,
• the second electrode layer is positioned in the resin layer,
• the first electrode layer is greater in thickness than the second electrode layer,
• the first electrode and the second electrode of the first electrode layer are positioned inside a peripheral edge of the first side of the resin layer, and
• the first electrode and the second electrode of the third electrode layer are positioned inside a peripheral edge of the second side of the resin layer,
• wherein the light-emitting element is arranged on the electroplated coating of the first electrode of the first electrode layer.

A light-emitting device comprising:

• a substrate;
• and
• a light-emitting element mounted on the substrate, wherein
• the substrate comprises a first electrode layer comprising a first electrode and a second electrode, a second electrode layer comprising a first electrode and a second electrode, a third electrode layer comprising a first electrode and a second electrode, and a resin layer,
• the first electrode layer is arranged on a first side of the resin layer, and the third electrode layer is arranged on a second side that is an opposite side of the first side of the resin layer,
• the second electrode layer is positioned in the resin layer,
• the first electrode layer is greater in thickness than the second electrode layer,
• the light-emitting element is mounted on the first electrode of the first electrode layer, and the light-emitting element is electrically connected to the first electrode and the second electrode of the first electrode layer,
• the first electrode and the second electrode of the first electrode layer are positioned inside a peripheral edge of the first side of the resin layer,
• the first electrode and the second electrode of the third electrode layer are positioned inside a peripheral edge of the second side of the resin layer,
• the first electrode of the second electrode layer in the resin layer comprises a first connecting portion that extends from the first electrode of the second electrode layer toward a peripheral side of the resin layer, and the second electrode of the second electrode layer in the resin layer comprises a second connecting portion that extends from the second electrode of the second electrode layer toward the peripheral side of the resin layer,
• the first electrode of the first electrode layer, the first electrode of the second electrode layer, and the first electrode of the third electrode layer are electrically connected to one another through filled vias, and
• the second electrode of the first electrode layer, the second electrode of the second electrode layer, and the second electrode of the third electrode layer are electrically connected to one another through filled vias.

A method of manufacturing a substrate assembly comprising:

• preparing a first electrode layer assembly that comprises pairs of electrodes, each pair of which comprises a first electrode and a second electrode that is smaller in area than the first electrode on a first side of a resin layer;
• preparing a second electrode layer assembly that is thinner than the first electrode layer assembly, the second electrode layer assembly comprises pairs of electrodes, each pair of which comprises a first electrode and a second electrode that is smaller in area than the first electrode and a first connecting portion that electrically connects first electrodes of the pairs of the second electrode layer assembly and a second connecting portion that electrically connects second electrodes of the second electrode layer assembly on a second side of the resin layer;
• arranging an additional resin in a state of liquid to form the resin layer covering the second electrode layer assembly such that the pairs of the electrodes of the second electrode layer assembly are buried in the resin layer;
• and
• arranging a metallic layer on a second side of the resin layer in which the pairs of the electrodes of the second electrode layer assembly is buried, the second side being an opposite side of the first side of the resin layer to form a third electrode layer assembly of the substrate assembly;
• forming filled vias to be arranged through the first electrode layer assembly in the resin layer to electrically connect the first electrode layer assembly and the second electrode layer assembly;
• forming filled vias to be arranged through the third electrode layer assembly in the resin layer to electrically connect the third electrode layer assembly and the second electrode layer assembly;
• forming an electroplated coating on the first electrode layer assembly and the filled vias that are arranged through the first electrode assembly layer;
• and
• forming an electroplated coating on the third electrode layer assembly and the filled vias that are arranged through the third electrode assembly layer.