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US 9,852,973 B2Granted
Manufacturing method of chip package and package substrate
AssigneeMediatek Inc.
InventorsWen-Sung Hsu, Ta-Jen Yu
Life of this patent
Estimating the term…
Abstract
A manufacturing method of a package substrate is provided. The method includes forming a first circuit layer on a carrier. A passive component is disposed on the first circuit layer and the carrier. A dielectric layer is formed on the carrier to embed the passive component and the first circuit layer in the dielectric layer. A second circuit layer is formed on the dielectric layer. The carrier is removed from the dielectric layer. A manufacturing method of a chip package is also provided.
Claims20
A manufacturing method of a package substrate, comprising:
- forming a conductive layer on a carrier;
- forming a first circuit layer on the conductive layer;
- disposing a passive component on the first circuit layer and the carrier;
- forming a dielectric layer and an adhesive layer on the carrier to embed the passive component and the first circuit layer in the dielectric layer, wherein the first dielectric material layer has a cavity exposing a portion of the adhesive layer;
- forming a second circuit layer on the dielectric layer;
- removing the carrier from the conductive layer;
- and
- patterning the conductive layer.
5 more elements
A manufacturing method of a chip package, comprising:
- forming a conductive layer on a carrier;
- forming a first circuit layer on the conductive layer;
- disposing a passive component on the first circuit layer and the carrier;
- forming a dielectric layer and an adhesive layer on the carrier to embed the passive component and the first circuit layer in the dielectric layer, wherein the first dielectric material layer has a cavity exposing a portion of the adhesive layer;
- forming a second circuit layer on the dielectric layer;
- removing the carrier from the conductive layer;
- patterning the conductive layer;
- and
- disposing a chip on the first circuit layer, wherein the chip is electrically connected to the first circuit layer and the passive component.
6 more elements
Dependencies are inferred from the claim text.