Interposer, semiconductor package structure, and semiconductor process
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsWen-Long Lu, Min Lung Huang
Life of this patent
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Abstract
An interposer includes an interconnection structure and a redistribution layer. The interconnection structure includes a metal layer, at least one metal via and an isolation material. The metal layer defines at least one through hole having a side wall. The at least one metal via is disposed in the through hole. A space is defined between the at least one metal via and the side wall of the through hole, and the isolation material fills the space. The redistribution layer is disposed on a surface of the interconnection structure and is electrically connected to the metal via.
Claims19
An interposer, comprising:
- an interconnection structure comprising:
- a metal layer defining at least one through hole having a side wall;
- at least one metal via disposed in the through hole, and a space defined between the at least one metal via and the side wall of the through hole;
- and
- an isolation material filling the space;
- and
- a redistribution layer disposed on a surface of the interconnection structure and electrically connected to the metal via, wherein the redistribution layer is electrically connected to the metal layer.
A semiconductor package structure, comprising:
- an interposer comprising:
- an interconnection structure comprising:
- a metal layer defining a through hole having a side wall;
- a metal via disposed in the through hole;
- an isolation material filling a space between the metal via and the side wall of the through hole;
- a redistribution layer electrically connected to the metal layer;
- and
- a semiconductor die disposed on and electrically connected to the interposer.
An interposer, comprising:
- a metal layer defining at least one through hole having a side wall, the metal layer having a first surface and a second surface opposite the first surface;
- at least one metal via disposed in the through hole, and a space defined between the metal via and the side wall of the through hole;
- an isolation material filling the space;
- and
- a redistribution layer disposed on the first surface of the metal layer and electrically connected to the metal via, wherein:
- the redistribution layer is electrically connected to the metal layer, and
- the metal via has a first surface substantially coplanar with the first surface of the metal layer, and the metal via has a second surface substantially coplanar with the second surface of the metal layer.
Dependencies are inferred from the claim text.