Semiconductor device including a sealing region

A semiconductor device, comprising:

• an insulating substrate on which is mounted a main circuit component including a semiconductor chip;
• a printed substrate, opposing the insulating substrate, wherein a conductive connection member connected to the semiconductor chip is disposed on the surface opposing the insulating substrate;
• a first sealing member that seals so as to enclose the semiconductor chip between the opposing surfaces of the insulating substrate and the printed substrate;
• a second sealing member that covers the side surfaces, but not the bottom surface, of the insulating substrate, the side surfaces of the first sealing member, and the side surfaces and upper surface of the printed substrate;
• and
• a sealing region regulation rod portions disposed in an outermost side peripheral portion of a sealing region of the first sealing member and connected between the insulating substrate and the printed substrate, the sealing region regulation rod portions being disposed such that they do not penetrate the second sealing member, wherein
• the heat resistance temperature of the first sealing member is higher than the heat resistance temperature of the second sealing member.