Lead frame structure for light emitting diode
AssigneeEcocera Optronics Co., Ltd.
InventorYu-Jen Lin
Life of this patent
Estimating the term…
Abstract
A lead frame structure of a light emitting diode includes a ceramic bed, a metal layer and a plastic seat. The metal layer has a first metal circuit area, a second metal circuit area, a gap dividing the first metal circuit area and the second metal circuit area, and a metal ring surrounding the first metal circuit area, the second metal circuit area and the gap. The plastic seat has a hollow function area. The first metal circuit area, the second metal circuit area and a part of the metal ring expose the function area to make the metal (circuit) layer of the function area has no gap to avoid excess glue. This can efficiently accomplish to increase intensity, quality and reliability of the packaged products.
Claims12
A lead frame structure for a light emitting diode, comprising:
- a ceramic bed, having a first surface and a second surface corresponding thereto;
- a metal layer, having a first metal circuit area, a second metal circuit area, a gap dividing the first metal circuit area and the second metal circuit area, and a metal ring surrounding the first metal circuit area, the second metal circuit area and the gap, wherein the first metal circuit area, the second metal circuit area and the metal ring are formed on the first surface of the ceramic bed;
- and
- a plastic seat, formed on the first surface, partially covering the metal ring, having a hollow function area, wherein the first metal circuit area, the second metal circuit area and a part of the metal ring expose the function area.
Dependencies are inferred from the claim text.