Semiconductor package
AssigneeMediatek Inc.
InventorNan-Jang Chen
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a die pad, a semiconductor die mounted on the die pad, a plurality of leads including a power lead disposed along a peripheral edge of the die pad, at least one connecting bar connecting the die pad, a power bar disposed on one side of the connecting bar, and a surface mount device (SMD) having a first terminal and a second terminal. The first terminal is electrically connected to the ground level through a first bond wire. The second terminal is electrically connected a power level through a second bond wire.
Claims17
A semiconductor package, comprising:
- a die pad;
- a semiconductor die mounted on the die pad;
- a plurality of leads comprising a power lead disposed along a peripheral edge of the die pad;
- at least one connecting bar connecting with the die pad via a ground bar;
- a power bar disposed on one side of the connecting bar, wherein the power bar is integrally connected to the power lead and extends along peripheral edges of the die pad;
- and
- a capacitor electrically coupled between the power bar and the connecting bar.
A semiconductor package, comprising:
- a die pad;
- a semiconductor die mounted on the die pad;
- a plurality of leads comprising a power lead disposed along a peripheral edge of the die pad;
- at least one connecting bar connecting the die pad;
- a power bar disposed on one side of the connecting bar, wherein the power bar is integrally connected to the power lead and is flush with the die pad;
- and
- a capacitor mounted between the power bar and the die pad.
A semiconductor package, comprising:
- a die pad;
- a semiconductor die mounted on the die pad;
- a plurality of leads comprising a power lead disposed along a peripheral edge of the die pad;
- at least one connecting bar connecting the die pad;
- a ground bar disposed on one side of the connecting bar, wherein the ground bar is integrally connected to the die pad;
- a power bar disposed on one side of the connecting bar, wherein the power bar is integrally connected to the power lead and is flush with the around bar;
- and
- a capacitor mounted between the power bar and the ground bar.
A semiconductor package, comprising:
- a die pad;
- a semiconductor die mounted on the die pad;
- a plurality of leads comprising a power lead disposed along a peripheral edge of the die pad;
- at least one connecting bar connecting the die pad;
- and
- a surface mount device (SMD) comprising a first terminal and a second terminal, wherein the first terminal is electrically connected to a ground level through a first bond wire, and wherein the second terminal is electrically connected a power level through a second bond wire.
Dependencies are inferred from the claim text.