Microprocessor assembly adapted for fluid cooling

A microprocessor assembly adapted for fluid cooling, the microprocessor assembly comprising:

• a substrate comprising:
• a first surface;
• and a second surface opposite the first surface;
• a semiconductor die comprising:
• a bottom surface;
• and a top surface opposite the bottom surface, the bottom surface of the semiconductor die mounted on the first surface of the substrate;
• an integrated heat spreader comprising:
• an outer surface;
• an inner surface;
• and a perimeter sealing surface, the integrated heat spreader positioned over the semiconductor die with the perimeter sealing surface of the integrated heat spreader attached to the first surface of the substrate;
• a layer of thermal interface material on the top surface of the semiconductor die and extending from the top surface of the semiconductor die to the inner surface of the integrated heat spreader;
• and
• a heat sink module comprising a bottom surface sealed against the outer surface of the integrated heat spreader, the heat sink module further comprising:
• an inlet port fluidly connected to an inlet chamber;
• a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber;
• and an outlet port fluidly connected to the outlet chamber, wherein a portion of the outer surface of the integrated heat spreader serves as a bounding surface of the outlet chamber, and the plurality of orifices are configured to deliver a plurality of jet streams of coolant into the outlet chamber and against the outer surface of the integrated heat spreader when pressurized coolant is provided to the inlet chamber.

A microprocessor assembly adapted for direct-to-die fluid cooling, the microprocessor assembly comprising:

• a substrate comprising:
• a first surface;
• and a second surface opposite the first surface;
• a semiconductor die comprising:
• a bottom surface;
• and a top surface opposite the bottom surface, the bottom surface of the semiconductor die mounted on the first surface of the substrate;
• a heat sink module comprising a bottom surface sealed against the first surface of the substrate and over the semiconductor die, the heat sink module further comprising:
• an inlet port fluidly connected to an inlet chamber;
• a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber;
• and an outlet port fluidly connected to the outlet chamber, wherein a portion of the first surface of the substrate serves as a bounding surface of the outlet chamber, wherein the semiconductor die is positioned within the outlet chamber of the heat sink module, and the plurality of orifices are configured to deliver a plurality of jet streams of coolant into the outlet chamber and against the semiconductor die when pressurized coolant is provided to the inlet chamber.