Underfill dispensing using funnels
AssigneeInternational Business Machines Corporation
InventorsEvan George Colgan, Michael Anthony Gaynes, Katsuyuki Sakuma, Donald Alan Merte
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Abstract
Arrays of objects on a substrate having void-free underfill as well as methods and systems of forming the same include forming a void-free layer of underfill material between a substrate and an array of multiple objects positioned on the substrate. The void-free layer of underfill material is cured to form a protective cured underfill layer that provides structural support to connections between the objects and the substrate.
Claims18
A method for underfilling an array of objects on a substrate, comprising:
- forming a void-free layer of underfill material between a substrate and an array of multiple objects positioned on the substrate by dispensing underfill material at multiple points on the substrate at substantially the same time;
- and
- curing the void-free layer of underfill material to form a protective cured underfill layer that provides structural support to connections between the objects and the substrate.
A system for underfilling an array of objects on a substrate, comprising:
- a plurality of funnels disposed at multiple points of a substrate, each comprising a funnel reservoir;
- and
- a dispenser configured to maneuver an underfill dispensing nozzle to each of the funnels in sequence and to dispense underfill material into each respective funnel reservoir.
A multi-laminate wafer, comprising:
- an array of a plurality of laminates individually bonded to a first layer of a wafer;
- one or more second circuit layers bonded to the plurality of laminates;
- and
- a void-free layer of cured underfill material that completely fills a space between each of the plurality of laminates and the first layer.
Dependencies are inferred from the claim text.