Testing, manufacturing, and packaging methods for semiconductor devices

A method of manufacturing a semiconductor device, the method comprising:

• providing an integrated circuit die comprising a plurality of contact pads disposed thereon;
• forming a first insulating material over the integrated circuit die and the plurality of contact pads;
• forming a first opening in the first insulating material over each of the plurality of contact pads;
• forming a conductive pillar over each of the plurality of contact pads through the first openings;
• forming a second insulating material over the conductive pillars and the first insulating material;
• forming a second opening in the second insulating material over each of the conductive pillars;
• forming a eutectic material in the second openings over each of the conductive pillars;
• electrically testing the integrated circuit die by probing the eutectic material disposed over each of the conductive pillars;
• and
• removing the eutectic material.

A method of packaging a semiconductor device, the method comprising:

• providing a wafer comprising a plurality of integrated circuit dies disposed thereon, each of the plurality of integrated circuit dies comprising a plurality of conductive pillars disposed thereon;
• forming an insulating material over the wafer;
• forming an opening in the insulating material over each of the plurality of conductive pillars of the plurality of integrated circuit dies;
• forming a eutectic material in the openings over each of the plurality of conductive pillars of the plurality of integrated circuit dies, a width of a portion of the eutectic material over a first conductive pillar of the plurality of conductive pillars being less than a width of the first conductive pillar of the plurality of conductive pillars;
• electrically testing the plurality of integrated circuit dies by probing the eutectic material disposed over each of the plurality of conductive pillars;
• removing the eutectic material;
• singulating the plurality of integrated circuit dies;
• and
• packaging the plurality of integrated circuit dies that passed the electrical testing.