Apparatus and method for processing a substrate
AssigneeNational Taiwan University of Science and Technology
InventorsBing-Joe Hwang, Wei-Nien Su, Jeng-Ywan Jeng, Yuan-Han Chu, Tse-Ming Chiu, Hsin-Fu Teng
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Abstract
A method of processing a substrate is disclosed. The method includes the following steps: providing a substrate body having a surface; placing a die on the surface, wherein the die acts as a catalyst; immersing the substrate body and the die in a reaction solution; and processing the substrate body via a chemical reaction occurring on the surface through the reaction solution and the catalyst.
Claims13
A method of processing a substrate, comprising steps of:
- providing a substrate body having a surface;
- placing a die on the surface, wherein the die acts as a catalyst;
- immersing the substrate body and the die in a reaction solution;
- and
- processing the substrate body via a chemical reaction occurring on the surface through the reaction solution and the catalyst,
- wherein the reaction solution includes an etching accelerator being one selected from a group consisting of a glycine, a lysine, a copper sulfate, a copper nitrate, a copper chloride and a combination thereof.
A method of forming a pattern on a non-conductive substrate, comprising steps of:
- providing a substrate body having a surface;
- and
- forming the pattern on the surface via a catalytic reaction,
- wherein the reaction solution includes an etching accelerator being one selected from a group consisting of a glycine, a lysine, a copper sulfate, a copper nitrate, a copper chloride and a combination thereof.
Dependencies are inferred from the claim text.