Method for manufacturing a conductor to be used as interconnect member

A method for manufacturing a conductor, the method comprising:

• preparing a substrate structure and a first conductive material set, wherein the substrate structure has a recess, and wherein a first portion of the first conductive material set is positioned at the recess;
• applying a first electric current and a first ultrasonic wave for dissolving the first portion of the first conductive material set to obtain a first opening;
• applying a second electric current and a second ultrasonic wave for depositing a second conductive material set on the first conductive material set, wherein a first portion of the second conductive material set is positioned at a position of the first opening;
• applying a third electric current and a third ultrasonic wave for dissolving the first portion of the second conductive material set to obtain a second opening;
• and
• providing a third conductive material set through the second opening into the recess.