Semiconductor memory device and method for manufacturing the same
AssigneeToshiba Memory Corporation
InventorsWataru Sakamoto, Hideki Inokuma, Osamu Matsuura
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AssigneeToshiba Memory Corporation
InventorsWataru Sakamoto, Hideki Inokuma, Osamu Matsuura
Estimating the term…
According to one embodiment, a semiconductor memory device includes a substrate, a stacked body, and a plurality of columnar parts. The stacked body is provided on the substrate. The stacked body includes a plurality of electrode films stacked separately from each other. The plurality of columnar parts is provided in the stacked body. Each of the plurality of columnar parts includes a semiconductor pillar extending in a stacking direction of the stacked body, and a charge storage film provided between the semiconductor pillar and the stacked body. The plurality of electrode films includes a first electrode film provided in upper layers of the stacked body and a second electrode film provided in lower layers of the stacked body. A thickness of the first electrode film is thicker than a thickness of the second electrode film. The first electrode film is provided with a void.
A semiconductor memory device comprising:
Dependencies are inferred from the claim text.