Stacked conductor structure and methods for manufacture of same
AssigneeAnalog Devices, Inc.
InventorBaoxing Chen
Life of this patent
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Abstract
A circuit structure that includes a plurality of stacked conductor layers separated from each other by respective dielectric layers. The conductor layers may include a first set of conductor layers made of a first type conductor material and a second set of conductor layers made of a second type conductor material different from the first. A pair of conductor posts may traverse the stacked conductor layers. A first post may be electrically connected to the first set of conductor layers and electrically insulated from the second set of conductor layers. A second post electrically connected to the second set of conductor layers and electrically insulated from the first set of conductor layers.
Claims20
A circuit structure, comprising:
- a plurality of stacked conductor layers separated from each other by respective dielectric layers made of a first type of dielectric material, the plurality of stacked conductor layers including a first set of conductor layers made of a first type of conductor material and a second set of conductor layers made of a second type of conductor material different from the first type of conductor material, and
- a conductor post electrically connected to the first set of conductor layers and electrically insulated from the second set of conductor layers by a set of insulating layers in-plane with the second set of conductor layers and made of a second type of dielectric material different than the first type of dielectric material.
A circuit structure, comprising:
- a first set of stacked conductor layers and a second set of stacked conductor layers, wherein the first and second sets of stacked conductor layers are separated from each other by a set of dielectric layers made of a first type of dielectric material;
- and
- a conductor post traversing the first and second sets of stacked conductor layers, the conductor post in electrical contact with the first set of stacked conductor layers and insulated from the second set of stacked conductor layers by a set of insulating layers of a second type of dielectric material different from the first type of dielectric material.
A circuit structure comprising:
- a plurality of stacked conductor layers separated from each other by respective dielectric layers, the plurality of stacked conductor layers including a first conductor layer made of a first type of conductor material and a second conductor layer adjacent the first conductor layer and made of a second type of conductor material different from the first type of conductor material, and
- a conductor post electrically connected to the first conductor layer and electrically insulated from the second conductor layer,
- wherein a periphery of the first conductor layer aligns with a periphery of the second conductor layer, and
- wherein the conductor post is electrically insulated from the second conductor layer by an insulating layer of a material different than the respective dielectric layers.
Dependencies are inferred from the claim text.