Substrate processing apparatus, substrate processing method, and recording medium

A substrate processing apparatus comprising:

• a holding unit configured to hold a substrate;
• a rotation unit configured to rotate the holding unit;
• a processing liquid supply nozzle configured to supply a processing liquid onto the substrate held in the holding unit from a position above the substrate;
• and
• a heating device configured to heat an outer peripheral portion of the substrate held in the holding unit, the heating device being positioned below the substrate,
• wherein the heating device includes:
• a discharge flow path through which a gas is discharged in a first direction toward the outer peripheral portion of the substrate held in the holding unit, the first direction being a direction from a position below the substrate toward the substrate;
• a branch flow path through which a gas is discharged in a second direction opposite to the first direction;
• and
• a heating unit configured to heat the discharge flow path and the branch flow path such that the gas is heated at the discharge flow path and at the branch flow path and is discharged in the first direction and the second direction through the discharge flow path and the branch flow path, respectively,
• wherein the heating device further includes a facing plate which is provided with the discharge flow path and the branch flow path therein and faces the substrate held in the holding unit,
• the discharge flow path communicates with at least one first discharge opening formed in a facing surface of the facing plate, which faces the substrate,
• the branch flow path communicates with a second discharge opening formed in a surface opposite to the facing surface of the heating device, and
• the second discharge opening is configured to face a side opposite to a side to which the at least one first discharge opening faces, such that the gas is discharged in opposite directions to each other.