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US 9,852,929 B2Granted
Lead frame and manufacturing method of lead frame
AssigneeMitsui High-Tec, Inc.
InventorTakahiro Ishibashi
Life of this patent
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Abstract
A lead frame includes a lead frame body processed in a predetermined shape, and including a notched part provided at an end of the lead frame body, the notched part being used as a starting point of tape-removing, a resin leakproof tape stuck on a back surface of the lead frame body, and a region of a periphery of the notched part in the back surface of the lead frame body, the region being reduced in a strength of bonding between the resin leakproof tape and the lead frame body is reduced relative to other region.
Claims12
A lead frame in a predetermined shape, comprising:
- a lead frame body;
- a plurality of unit lead frames arranged in the lead frame body at a distance away from an end of the lead frame body;
- a notched part extending through the lead frame body at the end of the lead frame body;
- a resin leakproof tape stuck on a back surface of the lead frame body, and the plurality of unit lead frames;
- and
- one of a plated region and a recessed thin region provided on the back surface of the lead frame body and located between an edge of the notched part and a closest end of the plurality of unit lead frames with a gap from the edge of the notched part, the one of a plated region and a recessed thin region being reduced in a strength of bonding between the resin leakproof tape and the lead frame body relative to an adjacent region of the back surface of the lead frame body.
3 more elements
Dependencies are inferred from the claim text.