Embedding additive particles in encapsulant of electronic device
AssigneeInfineon Technologies AG
InventorsPeh Hean Teh, Jagen Krishnan, Swee Kah Lee, Poh Cheng Lim, Joachim Mahler, Chew Theng Tai, Yik Yee Tan, Soon Lock Goh
Life of this patent
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Abstract
An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and a plurality of capsules in the encapsulant, wherein the capsules comprise a core comprising an additive and comprise a shell, in particular a crackable shell, enclosing the core.
Claims22
An electronic device, the device comprising:
- a carrier having a mounting surface;
- at least one electronic chip mounted on the mounting surface;
- an encapsulant at least partially encapsulating the carrier and the at least one electronic chip;
- a plurality of islands dispersed in an interior of the encapsulant, wherein the islands are formed by an adhesion promoting material contained within cores of a plurality of capsules included within the encapsulant, each core comprising a shell that is crackable in response to an external impact while remaining in the encapsulant, the islands comprising the adhesion promoting material, wherein at least part of the islands has a dimension in at least one spatial direction in a range between 100 nm and 200 μm.
An electronic device, the device comprising:
- a carrier having a mounting surface;
- at least one electronic chip mounted on the mounting surface;
- an encapsulant at least partially encapsulating the carrier and the at least one electronic chip;
- a plurality of capsules dispersed in an interior of the encapsulant, wherein the capsules comprise a core comprising an additive and comprise a shell, in
- particular a crackable shell, enclosing the core, wherein the shell is configured to be crackable in response to an external impact while remaining in the encapsulant.
A method of manufacturing an electronic device, the method comprising:
- mounting at least one electronic chip on a mounting surface of a carrier;
- at least partially encapsulating the carrier and the at least one electronic chip by an encapsulant;
- embedding and dispersing a plurality of capsules in an interior of the encapsulant, wherein the capsules comprise a core comprising an additive
- and comprise a shell, in particular a crackable shell, enclosing the core, wherein the shell is configured to be crackable in response to an external impact while remaining in the encapsulant.
A substance for adjusting conditions in an encapsulant encapsulating components of an electronic device, wherein the substance comprises:
- a plurality of capsules embeddable and dispersible in an interior of an encapsulant of the electronic device;
- wherein the capsules comprise a core and a shell enclosing the core;
- wherein the core comprises an additive capable of adjusting the conditions in the encapsulant;
- wherein the shell is configured to be crackable in response to an external impact while remaining in the encapsulant.
Dependencies are inferred from the claim text.