Detection module, inspection system and a method for obtaining multiple sensing results
AssigneeApplied Materials Israel Ltd.
InventorTal Kuzniz
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AssigneeApplied Materials Israel Ltd.
InventorTal Kuzniz
Estimating the term…
A detection module that includes a readout circuit and detector having a group of sensing elements. The group is configured to detect multiple beams. The multiple beams resulted from an illumination of a substrate, by an illumination module, by multiple electron beams. The readout circuit is configured to: (a) receive selection information for selecting multiple selected sub-groups of sensing elements; wherein the group of sensing elements comprises, in addition to the multiple selected sub-groups of sensing elements, a plurality of non-selected sensing elements; (b) ignore detection signals provided from the plurality of non-selected sensing elements, and (c) generate, for each selected sub-group of sensing elements, a sensing result to provide multiple sensing results that correspond to the multiple beams; and wherein the selected sub-groups of sensing elements are selected in response to at least one working condition of the illumination module.
A detection module comprising:
An inspection system, comprising:
A method for generating multiple sensing results, the method comprising:
Dependencies are inferred from the claim text.
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Details: detectors; Associated components or circuits therefor
Optical , image processing or photographic arrangements associated with the tube: image processing arrangements associated with the tube
Electron or ion microscopes; Electron or ion diffraction tubes: details
Electron or ion microscopes; Electron or ion diffraction tubes: with scanning beams
About 9 years 6 months of term left · ends 20 Apr 2036 (estimated)
A substrate such as a wafer can be illuminated, by an illumination module, with multiple electron beams.
A collection module collects multiple collected electron beams that are formed from the illumination of the substrate.
The collection module introduces aberrations to the collected electron beams.
The subject matter regarded as the invention is particularly pointed out and distinctly claimed in the concluding portion of the specification. The invention, however, both as to organization and method of operation, together with objects, features, and advantages thereof, may best be understood by reference to the following detailed description when read with the accompanying drawings in which:
FIG. 1 illustrates a system and a substrate according to an embodiment of the invention;
FIG. 2 illustrates a substrate and a portion of an image acquisition module of the system of FIG. 1 according to an embodiment of the invention;
It will be appreciated that for simplicity and clarity of illustration, elements shown in the figures have not necessarily been drawn to scale. For example, the dimensions of some of the elements may be exaggerated relative to other elements for clarity. Further, where considered appropriate, reference numerals may be repeated among the figures to indicate corresponding or analogous elements.
In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the invention. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known methods, procedures, and components have not been described in detail so as not to obscure the present invention.
The subject matter regarded as the invention is particularly pointed out and distinctly claimed in the concluding portion of the specification. The invention, however, both as to organization and method of operation, together with objects, features, and advantages thereof, may best be understood by reference to the following detailed description when read with the accompanying drawings.