Chip fuse and manufacturing method therefor
AssigneeKamaya Electric Co., Ltd.
InventorsKatsuya Yamagishi, Hideki Seino
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AssigneeKamaya Electric Co., Ltd.
InventorsKatsuya Yamagishi, Hideki Seino
Estimating the term…
In a chip fuse, a heat-storing layer is formed on an insulated substrate, a fuse film is formed on the heat-storing layer, and a protective film is formed on the fuse element section. The chip fuse includes surface electrode sections on both ends in the length direction of the chip fuse and a fuse element section between the surface electrode sections. In this chip fuse, a rectangular bank section is formed over the heat-storing layer and the surface electrode sections to surround the fuse element section, and a first protective layer is formed on the inner side of the bank section. In addition, during the bank formation process, a sheet-like photosensitive-group-containing material is laminated on the fuse element section, surface electrode sections, and heat-storing layer, and the sheet-like photosensitive-group-containing material is exposed to ultraviolet light and developed to form the rectangular bank section.
A chip fuse comprising:
A manufacturing method for the chip fuse that includes,
Dependencies are inferred from the claim text.