SpaceCube V2.0 micro single board computer
AssigneeUnited States of America as represented by the Administrator of NASA
InventorsDavid J. Petrick, Alessandro Geist, Michael R. Lin, Gary R. Crum
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Abstract
A single board computer system radiation hardened for space flight includes a printed circuit board having a top side and bottom side; a reconfigurable field programmable gate array (FPGA) processor device disposed on the top side; a connector disposed on the top side; a plurality of peripheral components mounted on the bottom side; and wherein a size of the single board computer system is not greater than approximately 7 cm×7 cm.
Claims17
A single board computer system radiation hardened for space flight, the single board computer system comprising:
- a printed circuit board, the printed circuit board having a top side and bottom side, the printed circuit board comprising a plurality of layers arranged symmetrically in a two-halves configuration above and below a central plane of the printed circuit board;
- a field programmable gate array (FPGA) processor device disposed on the top side;
- a connector disposed on the top side;
- and
- a plurality of peripheral components mounted on the bottom side,
- wherein a size of the single board computer system is not greater than approximately 7 cm×7 cm, and
- wherein a layout stack-up of the printed circuit board comprises fourteen layers including four ground layers, four power layers, four signal layers, a top layer, and a bottom layer.
A single board computer system radiation hardened for space flight, the single board computer system comprising:
- a printed circuit board, the printed circuit board having a top side and bottom side, the printed circuit board comprising a plurality of layers arranged symmetrically in a two-halves configuration above and below a central plane of the printed circuit board;
- a field programmable gate array (FPGA) processor device disposed on the top side;
- a connector disposed on the top side;
- and
- a plurality of peripheral components mounted on the bottom side,
- wherein a size of the single board computer system is not greater than approximately 7 cm×7 cm,
- wherein the layout stack-up of the top side of the printed circuit board comprises:
- a first power layer;
- a second power layer over the first power layer;
- a first signal layer over the second power layer;
- a first ground layer over the first signal layer;
- a second signal layer over the first ground layer;
- a second ground layer over the second signal layer;
- and
- a top layer of the printed circuit board over the second ground layer.
A multi-layer printed circuit board for a single board radiation hardened processing system, the multi-layer printed circuit board comprising:
- a top half;
- a bottom half;
- and
- a center plane therebetween;
- and
- a layout stack-up of the multi-layer printed circuit board, the layout stack-up comprising:
- a pair of ground layers,
- a pair of signal layers, and
- a pair of power layers on the top half and the bottom half of the printed circuit board;
- a top Layer and a bottom layer of the printed circuit board including a plurality of land pads for connecting electrical components to the printed circuit board, the printed circuit board comprising a plurality of layers arranged symmetrically in a two-halves configuration above and below a central plane of the printed circuit board,
- wherein the stack-up layout comprises the pairs of power layers being positioned near the top layer and the bottom layer, respectively, and
- wherein the top and bottom layer of the stack-up layout comprise:
- a first ground layer adjacent the center plane of the multi-layer printed circuit board;
- a first signal layer over the first ground layer;
- a first power layer over the first signal layer;
- a second signal layer over the first power layer;
- a second power layer over the second signal layer;
- and
- a second ground layer over the second power layer,
- wherein the top layer and the bottom layer of the printed circuit board are over respective ones of the second power layer.
A multi-layer printed circuit board for a single board radiation hardened processing system, the multi-layer printed circuit board comprising:
- a top half;
- a bottom half;
- and
- a center plane therebetween;
- and
- a layout stack-up of the multi-layer printed circuit board, the layout stack-up comprising:
- a pair of ground layers,
- a pair of signal layers, and
- a pair of power layers on the top half and the bottom half of the printed circuit board;
- a top layer and a bottom layer of the printed circuit board including a plurality of land pads for connecting electrical components to the printed circuit board, the printed circuit board comprising a plurality of layers arranged symmetrically in a two-halves configuration above and below a central plane of the printed circuit board,
- a reconfigurable field programmable gate array (FPGA) processor device and a connector disposed on the top side disposed on the top side of the multi-layer printed circuit board;
- and a plurality of peripheral components mounted on the bottom side of the multi-layer printed circuit board,
- wherein a size of the single board radiation hardened processing system is not greater than approximately 7 cm×7 cm;
- and
- the single board radiation hardened processing system is configured to execute 3,000 millions of instructions per second (MIPS).
Dependencies are inferred from the claim text.