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US 9,851,611 B2Granted
Electro-optical apparatus and electronic device
AssigneeSeiko Epson Corporation
InventorTomoaki Miyashita
Life of this patent
Estimating the term…
Abstract
Flexible substrates are drawn from two terminals provided on a TFT substrate, respectively, and IC chips are mounted on both flexible substrates. Both flexible substrates are placed so that positions of the IC chips provided on both flexible substrates overlap with each other.
Claims10
An electro-optical apparatus including:
- an electro-optical panel section having a first substrate formed with a circuit;
- a plurality of flexible substrates drawn from an end portion of the first substrate and stacked in the end portion of the first substrate;
- IC chips each fixed to the overlapping position of the IC chips in the plurality of flexible substrates;
- and
- a material filled in a position where the IC chip is placed between the plurality of flexible substrates, the plurality of flexible substrates being superimposed on each other,
- wherein the material has thermal conductivity higher than air;
- and
- wherein the IC chip supplies the electro-optical panel with a driving signal.
5 more elements
An electro-optical apparatus comprising:
- an electro-optical panel that has a first substrate, a first terminal group in an end section of the first substrate and a second terminal group in a position between the first terminal group and a region provided a plurality of pixel electrodes in the end section of the first substrate,
- a first flexible substrate that is electrically connected to the first terminal group;
- a second flexible substrate that is electrically connected to the second terminal group, the second flexible substrate overlaps with the first flexible substrate;
- a first IC chip that is provided on a first surface of the first flexible substrate;
- and
- a second IC chip that is provided on a second surface of the second flexible substrate and overlaps with the first IC chip;
- and
- a material filled in a position where the IC chip is placed between the plurality of flexible substrates, the plurality of flexible substrates being superimposed on each other,
- wherein the material has thermal conductivity higher than air, and
- wherein the IC chip supplies the electro-optical panel with a driving signal.
7 more elements
Dependencies are inferred from the claim text.